SATYA MOORTHI.C

c/o Jaganathan.s,
2049,AVE DE LAS FLORES,
SANTACALRA,CA-95054.
Ph:408-727-1296 (Res); 408-450-8000 (Off.)
I . OBJECTIVE:

* To obtain a challenging carrier IC Assembly Packaging Engineering and to become specialist in IC Assembly.

II . SUMMARY OF QUALIFICATION:

* Excellent Knowledge in Assembly packaging process.
* Good skill in handling Front end equipment's like Dicing saw,Diebonder, Wirebonder. * Familiar in handling all packages like 300 Mill DIPs ,150Mill SOs/QSOPs and VSOPs. * Very good communication skill gained through handling offshore customers by operating on subcontract assembly.
* Good skill in installation and troubleshooting in all the front end equipment's. * Familiar and operated in UNIX environments and ORACLE7.1 and WIN'95. * Passed a 3 year diploma in Mechanical engineering in Government polytechnic * Passed out as top ranking in BE Electrical and Electronics Engineering from PSG college of Technology, Bharathiar university,India.

III . HIGHLIGHTS AND ACHIEVEMENTS:

1 . 1993 June to 1997 June , as Production process engineer ,Spic electronic and system Ltd. India.
Responsible for Process control ,Trouble shoot the equipment's, training and Yield improvements.

* Optimized loop heights for various thick/thin packages for different customers. * Introduced rubber collets for Diepickups in Shinkawa diebonding machines. * Launched new products to Spel: SOIC,QSOP,VSOP,SSOP(14/16/20/24/28/40/48/56). * Optimized the usage of different types of nozzles including multipin nozzles. * Implemented and formulated all front end work-instructions for ISO9002 Quality system. * Identified and graded different level of wirebonder capabilities in Shinkawa UTC-40. * Trained the operators and formulated a training certification system for different cross training of operators.
* Material optimization for different customers.

2 . 1997 June to till now as Deputy Manager production. Responsible for Front end Production and process Engineering.

* Worked on calculation of Bill of material for different packages and customers and Worked on costing for different packages and customers.


IV . ADDITIONAL INFORMATION:

Good Knowledge in Transfer Molding and form singulation operations also. Handling
offshore assembly contracts.

WORK PLACE PREFERENCE:

Any where in US.



Attachment Converted: C:\SHORE95\EUDORA\goose123.doc

SATYAMOORTHI.C

c/o Jaganathan.s,
2049,AVE DE LAS FLORES,
SANTACALRA,CA-95054.
Ph:408-727-1296 (Res); 408-450-8000 (Off.)
I . OBJECTIVE:

* To obtain a challenging carrier IC Assembly Packaging Engineering and to become specialist in IC Assembly.

II . SUMMARY OF QUALIFICATION:

* Excellent Knowledge in Assembly packaging process.
* Good skill in handling Front end equipment's like Dicing saw,Diebonder, Wirebonder. * Familiar in handling all packages like 300 Mill DIPs ,150Mill SOs/QSOPs and VSOPs. * Very good communication skill gained through handling offshore customers by operating on subcontract assembly.
* Good skill in installation and troubleshooting in all the front end equipment's. * Familiar and operated in UNIX environments and ORACLE7.1 and WIN'95. * Passed a 3 year diploma in Mechanical engineering in Government polytechnic * Passed out as top ranking in BE Electrical and Electronics Engineering from PSG college of Technology, Bharathiar university,India.

III . HIGHLIGHTS AND ACHIEVEMENTS:

1 . 1993 June to 1997 June , as Production process engineer ,Spic electronic and system Ltd. India.
Responsible for Process control ,Trouble shoot the equipment's, training and Yield improvements.

* Optimized loop heights for various thick/thin packages for different customers. * Introduced rubber collets for Diepickups in Shinkawa diebonding machines. * Launched new products to Spel: SOIC,QSOP,VSOP,SSOP(14/16/20/24/28/40/48/56). * Optimized the usage of different types of nozzles including multipin nozzles. * Implemented and formulated all front end work-instructions for ISO9002 Quality system. * Identified and graded different level of wirebonder capabilities in Shinkawa UTC-40. * Trained the operators and formulated a training certification system for different cross training of operators.
* Material optimization for different customers.

2 . 1997 June to till now as Deputy Manager production. Responsible for Front end Production and process Engineering.

* Worked on calculation of Bill of material for different packages and customers and Worked on costing for different packages and customers.


IV . ADDITIONAL INFORMATION:

Good Knowledge in Transfer Molding and form singulation operations also. Handling
offshore assembly contracts.

WORK PLACE PREFERENCE:

Any where in US.